Scaling Data Center Cooling
Optimizing thermal management from the chip level to the facility level becomes essential as data centers scale to support increasing AI, cloud computing, and hyperscale workload demands. Efficient cooling ensures maximum performance, uptime, and longevity while reducing operational costs. Boyd delivers comprehensive cooling solutions tailored for every level of the data center, from liquid cold plates (LCPs) at the microchip level to coolant distribution units (CDUs) that optimize facility-wide thermal operation.
Chip-Level Liquid Cooling: Boyd’s Liquid Cold Plates (LCPs)
Increasing processing power generates more heat at the chip level. Traditional air cooling fails to keep up with high-power CPUs and GPUs, causing thermal throttling and lowering efficiency. Boyd’s liquid cold plates (LCPs) deliver direct liquid cooling for high-performance processors, efficiently dissipating heat and maintaining optimal operating temperatures.
Blade-Level Cooling: Boyd’s Liquid Cooling Loops (LCLs)
Liquid cooling loops (LCLs) use cold plates, tubing, and manifolds to form closed-loop systems that effectively remove heat from high-density server components at the blade level. This design increases cooling efficiency and enables higher performing servers.
Boyd’s Rack-Level Liquid Cooling
Rack power densities are rising and efficiently cooling entire server racks is essential. Boyd’s liquid manifolds and in-rack Coolant Distribution Units (CDUs) distribute fluid across multiple servers and in-row CDUs distribute fluid across multiple racks. Boyd’s CDUs deliver reliable cooling for increasing power levels while reducing energy waste. Rack-level liquid cooling enhances energy efficiency to meet the growing thermal demands of AI and high-performance computing (HPC).
Boyd’s Thermal Modeling and Simulation
Maximizing cooling performance and energy efficiency throughout a facility requires a comprehensive strategy. Boyd’s sophisticated thermal modeling and simulation services help data center operators design cooling systems that optimize efficiency and scalability for increasing power densities. By examining each design choice in a liquid system, Boyd engineers create specialized cooling solutions that improve uptime and prolong the life of vital data center infrastructure.
Boyd: Lowering Data Center OPEX
Inefficient cooling increases operating expenses and energy consumption. According to the Uptime Institute’s Global Data Center Survey, the average Power Usage Effectiveness (PUE) for data centers is 1.58, meaning data centers use 0.58 more units of energy for overhead and cooling per unit consumed for computing. Advanced liquid cooling solutions help lower PUE to between 1.1 and 1.2, significantly improving energy efficiency. Boyd designs and produces liquid cooling systems holistically to maximize thermal performance, lower energy waste, and boost overall efficiency.
Future of Data Center Cooling
According to a report by MarketsandMarkets, the global data center cooling market is projected to grow from USD 12.7 billion in 2023 to USD 29.6 billion by 2030, reflecting a compound annual growth rate (CAGR) of 12.8% during the forecast period. As power densities and AI workloads increase, data centers will adopt integrated liquid cooling solutions as the standard for next-generation infrastructure.
Boyd: Holistic Data Center Cooling
From microchips to megawatts, Boyd applies liquid cooling expertise to help data centers achieve peak performance, reliability, and energy efficiency. By optimizing cooling at the chip, rack, and facility levels, our holistic approach maximizes uptime and extends equipment lifespan. Contact us today to discuss your data center cooling needs and discover how Boyd’s innovative solutions enhance thermal management strategies.
